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      CIS

      ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

      AUTOPIA

      Automatic Active Alignment System (for Automotive Camera Application)

      COSMOS

      Automatic 3D Sensing Alignment System

      Eagle AERO

      For High-end IC Applications

      Lens Holder Attach System

      IS600GS

      Automatic Active Alignment Bonding System for Camera Module Assembly

      Lens Holder Attach System

      IS868LA3

      Automatic Lens Holder Attach System

      DI-water Cleaning System

      ISCM868S

      Automatic DI-Water Cleaning System

      ISLinDA

      Automatic Die Bonding System (12” wafer handling)

      Ball Bonder OPTO/LED Wire Bonding Equipment

      Harrier Xtreme

      Dual-Head Extreme High Speed Wire Bonder

      OPTO/LED Wire Bonding Equipment

      iHawk Xpress XL

      Wire Bonder

      Ball Bonder OPTO/LED Wire Bonding Equipment

      iHawk Xtreme

      Wire Bonder

      Strip Form Substrates AOI System

      VIM300 / IS-VIM300

      Automated Optical Inspection

      Other Applications

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